Optical vertical interconnect and integration based on Silicon carrier

Bibliographic Details
Title: Optical vertical interconnect and integration based on Silicon carrier
Authors: Liu, Fengman, Chu, Yanbiao, Li, Baoxia, Song, Jian, Wang, Haidong, Du, Tianmin, Yang, Binbin, Wan, Lixi
Source: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :97-100 Aug, 2012
Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
Database: IEEE Xplore Digital Library