Optical vertical interconnect and integration based on Silicon carrier
Title: | Optical vertical interconnect and integration based on Silicon carrier |
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Authors: | Liu, Fengman, Chu, Yanbiao, Li, Baoxia, Song, Jian, Wang, Haidong, Du, Tianmin, Yang, Binbin, Wan, Lixi |
Source: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :97-100 Aug, 2012 |
Relation: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
Database: | IEEE Xplore Digital Library |
ISBN: | 9781467316804 9781467316828 9781467316811 |
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DOI: | 10.1109/ICEPT-HDP.2012.6474578 |
Published in: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on |