Optical vertical interconnect and integration based on Silicon carrier
| Title: | Optical vertical interconnect and integration based on Silicon carrier |
|---|---|
| Authors: | Liu, Fengman, Chu, Yanbiao, Li, Baoxia, Song, Jian, Wang, Haidong, Du, Tianmin, Yang, Binbin, Wan, Lixi |
| Source: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :97-100 Aug, 2012 |
| Relation: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| Database: | IEEE Xplore Digital Library |
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