Integrated Stress and Process Calibration in Strained-Si Devices

Bibliographic Details
Title: Integrated Stress and Process Calibration in Strained-Si Devices
Authors: Yu, T.-H., Tu, K.-C., Sheu, Y.-M., Diaz, C. H.
Source: 2009 International Conference on Simulation of Semiconductor Processes and Devices Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on. :1-4 Sep, 2009
Relation: 2009 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Database: IEEE Xplore Digital Library