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Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages

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Title: Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages
Authors: Grolier-Lee, Stelliane, Capellaro, Laurence, Mon, Aye Aye, Wong, Kim-Sing, Loh, Hung Meng, Caicedo, Nohora
Source: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :981-985 Dec, 2024
Relation: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
Database: IEEE Xplore Digital Library
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  Data: Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages
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  Data: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :981-985 Dec, 2024
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        Value: 10.1109/EPTC62800.2024.10909868
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        PageCount: 5
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            NameFull: Grolier-Lee, Stelliane
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            NameFull: Capellaro, Laurence
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            NameFull: Mon, Aye Aye
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            NameFull: Wong, Kim-Sing
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            NameFull: Loh, Hung Meng
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            NameFull: Caicedo, Nohora
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          Dates:
            – D: 03
              M: 12
              Type: published
              Y: 2024
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              Value: 9798331522001
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            – TitleFull: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th
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