Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages
| Title: | Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages |
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| Authors: | Grolier-Lee, Stelliane, Capellaro, Laurence, Mon, Aye Aye, Wong, Kim-Sing, Loh, Hung Meng, Caicedo, Nohora |
| Source: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :981-985 Dec, 2024 |
| Relation: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9798331522001 |
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| DOI: | 10.1109/EPTC62800.2024.10909868 |
| Published in: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th |