Bibliographic Details
| Title: |
Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages |
| Authors: |
Grolier-Lee, Stelliane, Capellaro, Laurence, Mon, Aye Aye, Wong, Kim-Sing, Loh, Hung Meng, Caicedo, Nohora |
| Source: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :981-985 Dec, 2024 |
| Relation: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |
