Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages

Bibliographic Details
Title: Doped SAC Solder Ball Alloys Comparison for High Performance Automotive BGA Packages
Authors: Grolier-Lee, Stelliane, Capellaro, Laurence, Mon, Aye Aye, Wong, Kim-Sing, Loh, Hung Meng, Caicedo, Nohora
Source: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :981-985 Dec, 2024
Relation: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
Database: IEEE Xplore Digital Library