A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA)
| Title: | A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA) |
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| Authors: | Ahn, Seok-Geun, Oh, Ju-Hyeon, Jeon, Gwang-Jae, Lee, Dae-Ho, Lee, Seok-Hyun |
| Source: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :556-562 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |
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