Bibliographic Details
| Title: |
A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA) |
| Authors: |
Ahn, Seok-Geun, Oh, Ju-Hyeon, Jeon, Gwang-Jae, Lee, Dae-Ho, Lee, Seok-Hyun |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :556-562 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
