| Title: |
Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology |
| Authors: |
Kang, Lewis, Kim, Jay, Lee, Bruce, Park, Jade, Yu, Han Ju, Lee, Sung Hyuk, Lim, Jacinta Aman, Lee, Min Ji, Han, Seong Hwan, Lee, Jae Kyung, Hwang, Hailey |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1603-1608 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
