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Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology

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Title: Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology
Authors: Kang, Lewis, Kim, Jay, Lee, Bruce, Park, Jade, Yu, Han Ju, Lee, Sung Hyuk, Lim, Jacinta Aman, Lee, Min Ji, Han, Seong Hwan, Lee, Jae Kyung, Hwang, Hailey
Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1603-1608 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Database: IEEE Xplore Digital Library
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  Data: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1603-1608 May, 2024
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RecordInfo BibRecord:
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        Value: 10.1109/ECTC51529.2024.00262
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      – TitleFull: Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology
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            NameFull: Kang, Lewis
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            NameFull: Yu, Han Ju
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            NameFull: Lee, Min Ji
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            NameFull: Han, Seong Hwan
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            NameFull: Lee, Jae Kyung
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            – D: 28
              M: 05
              Type: published
              Y: 2024
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