Micro electro mechanical system structures
| Title: | Micro electro mechanical system structures |
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| Patent Number: | 9,139,423 |
| Publication Date: | September 22, 2015 |
| Appl. No: | 13/353765 |
| Application Filed: | January 19, 2012 |
| Abstract: | A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure. |
| Inventors: | Chien, Ting-Ying (Hsinchu, TW); Chiu, Yi Hsun (Zhubei, TW); Su, Ching-Hou (Hsinchu, TW); Ni, Chyi-Tsong (Hsinchu, TW) |
| Assignees: | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) |
| Claim: | 1. A micro electro mechanical system (MEMS) structure comprising: a first substrate structure including a bonding pad structure, the bonding pad structure having at least one recess therein, wherein a width of the at least one recess is 10 microns (μm) or less; and a second substrate structure bonded with the bonding pad structure of the first substrate structure, wherein the second substrate structure comprises a second substrate and a second bonding pad structure, the second bonding pad structure extending into a substrate recess in a first substrate of the first substrate structure, and the second bonding pad structure includes a bonding pad recess located at least partially within the substrate recess. |
| Claim: | 2. The MEMS structure of claim 1 , wherein the at least one recess has a first slot continuously extending in the first bonding pad structure, such that the bonding pad structure of the first substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the first slot and disposed around a MEMS device. |
| Claim: | 3. The MEMS structure of claim 2 , wherein the at least one recess is a plurality of recesses defining a second slot continuously extending in the bonding pad structure, such that the bonding pad structure includes a third bond pad ring that is separated from the second bond pad ring by the second slot and disposed around the MEMS device. |
| Claim: | 4. The MEMS structure of claim 1 , wherein the bonding pad structure of the first substrate structure includes a bonding material that continuously extends along walls of the at least one recess. |
| Claim: | 5. The MEMS structure of claim 1 , wherein the second bonding pad structure is eutectically bonded with the bonding pad structure of the first substrate structure. |
| Claim: | 6. The MEMS structure of claim 5 , wherein a surface of the second substrate structure is substantially level with an interface between the bonding pad structure of the first substrate structure and the second bonding pad structure. |
| Claim: | 7. The MEMS structure of claim 5 , wherein a first portion of a surface of the second substrate corresponding to the bonding pad recess is farther from a closest surface of first substrate structure than a second portion of the surface of the second substrate. |
| Claim: | 8. The MEMS structure of claim 5 , wherein the second substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the bonding pad recess, and the first bond pad ring and the second bond pad ring extend into the substrate recess. |
| Claim: | 9. The MEMS structure of claim 5 , wherein a width of the bonding pad structure of the first substrate structure in the substrate recess is greater than a width of the second bonding pad structure that is bonded thereto. |
| Claim: | 10. A micro electro mechanical system (MEMS) structure comprising: a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device; and a handle substrate including a bonding pad structure, wherein the bonding pad structure is bonded with the first bond pad ring, and the second bond pad ring is located at least partially within a substrate recess of the device substrate. |
| Claim: | 11. The MEMS structure of claim 10 , wherein the first bond pad ring is separated from the second bond pad ring. |
| Claim: | 12. The MEMS structure of claim 10 , wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring. |
| Claim: | 13. The MEMS structure of claim 10 , wherein a width of the first bond pad ring is 30 microns (μm) or less. |
| Claim: | 14. The MEMS structure of claim 10 , wherein a distance between the second bond pad ring and the first bond pad ring is 10 μm or less. |
| Claim: | 15. The MEMS structure of claim 10 further comprising: a bonding material that continuously extends from the first bond pad ring to the second bond pad ring. |
| Claim: | 16. The MEMS structure of claim 10 , wherein the bonding pad structure has at least one recess therein, the at least one recess being partially located in the substrate recess, and the at least one recess continuously extends in the bonding pad structure, such that the bonding pad structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the at least one recess. |
| Claim: | 17. The MEMS structure of claim 10 , wherein surface areas of the first and second bond pad rings in the substrate recess are smaller than a surface area of the bonding pad structure that is bonded thereto. |
| Claim: | 18. A micro electro mechanical system (MEMS) structure comprising: a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device, wherein the first bond pad ring and the second bond pad ring each include at least one metallic material; and a handle substrate having a first handle bond pad ring and a second handle bond pad ring, wherein the first handle bond pad ring and the second handle bond pad ring extend into a substrate recess of the device substrate, the first handle bond pad ring is bonded with the first bond pad ring in the substrate recess and the second handle bond pad ring is bonded with the second bond pad ring in the substrate recess, and the handle substrate includes at least one semiconductor-containing material. |
| Claim: | 19. The MEMS structure of claim 18 , wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring. |
| Claim: | 20. The MEMS structure of claim 18 , wherein a width of the first bond pad ring is 30 microns (μm) or less. |
| Patent References Cited: | 7705413 April 2010 Weber et al. 7960208 June 2011 Carlson et al. 8575748 November 2013 Farino 8736081 May 2014 Foster et al. 2005/0077612 April 2005 Nikkel et al. 2005/0166677 August 2005 Nasiri et al. 2006/0115323 June 2006 Coppeta et al. 2008/0131662 June 2008 Jordan et al. 2008/0283990 November 2008 Nasiri et al. 2010/0072555 March 2010 Meng et al. 2010/0283138 November 2010 Chen et al. 2011/0233621 September 2011 Liu et al. 2011/0298063 December 2011 Mayer 2012/0045628 February 2012 Gonska et al. 2012/0149152 June 2012 Tsai et al. 2012/0187509 July 2012 Gottfried et al. 2013/0037891 February 2013 Huang et al. 2013/0099355 April 2013 Liu et al. 1910486 February 2007 102164847 August 2011 201131229 September 2011 |
| Other References: | Definition of level downloaded from URL<http://www.merriam-webster.com/dictionary/level> on Jul. 29, 2014. cited by examiner Definition of ‘within’ downloaded from URL< http://www.merriam-webster.com/dictionary/within > on Feb. 27, 2015. cited by examiner Farrens, Dr. Shari, “Bonding with Ali Metallurgies”, SUSS MicroTec, 228 Suss Drive, Waterbury Center, VT, USA 05677, 5 pages. cited by applicant Dragoi, V., et al., “Wafer Bonding with Metal Layer for MEMS Applications”, IEEE 2009, pp. 215-248. cited by applicant Jing, Errong, et al., “The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope”, IEEE Transactions on Electronics Packaging Manufacturing, vol. 33, No. 1, Jan. 2010, pp. 31-37. cited by applicant |
| Primary Examiner: | Schoenholtz, Joseph |
| Attorney, Agent or Firm: | Lowe Hauptman & Ham, LLP |
| Accession Number: | edspgr.09139423 |
| Database: | USPTO Patent Grants |
| Language: | English |
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