Bibliographic Details
| Title: |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| Document Number: |
20120279770 |
| Publication Date: |
November 8, 2012 |
| Appl. No: |
13/554315 |
| Application Filed: |
July 20, 2012 |
| Abstract: |
A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode. |
| Inventors: |
NAGATA, Hiroyasu (Ibi-gun, JP) |
| Assignees: |
IBIDEN CO., LTD. (Ogaki-shi, JP) |
| Claim: |
1. A method for manufacturing a printed wiring board, comprising: preparing an electronic component having a first surface and a second surface opposite the first surface, and having a first electrode formed on the first surface; forming in an adhesive tape a first alignment mark for mounting the electronic component; mounting based on the first alignment mark the electronic component on the adhesive tape in such a way that the second surface faces the adhesive side of the adhesive tape; forming a second alignment mark on an insulative substrate having a first surface and a second surface opposite the first surface; forming in the insulative substrate an opening section larger than the outer shape of the electronic component; mounting based on the first and second alignment marks the insulative substrate on the adhesive side of the adhesive tape in such a way that the electronic component is accommodated in the opening section of the insulative substrate; fixing the electronic component to the insulative substrate using resin material; removing the adhesive tape; forming a first resin insulation layer and a second resin insulation layer on the first surface and the second surface respectively of the insulative substrate in which the electronic component is accommodated; forming in the first resin insulation layer an opening that reaches the first electrode of the electronic component; forming a through-hole penetrating the first and second resin insulation layers and the insulative substrate; and forming a first conductive circuit and a second conductive circuit on the first and second resin insulation layers respectively, while forming in the opening of the first resin insulation layer a via conductor that connects the first conductive circuit and the first electrode of the electronic component, and on the inner wall of the through-hole, forming a through-hole conductor that connects the first and second conductive circuits. |
| Claim: |
2. The method for manufacturing a printed wiring board according to claim 1, further comprising forming in the second resin insulation layer an opening that reaches a second electrode, which is formed on the second surface of the electronic component, wherein a via conductor connecting the second conductive circuit and the second electrode of the electronic component is formed in the opening of the second resin insulation layer at the same time that the first and second conductive circuits are formed. |
| Claim: |
3. A printed wiring board, comprising: a core substrate having a first surface and a second surface opposite the first surface, and having an opening section larger than the outer shape of an electronic component to be accommodated; an electronic component accommodated in the opening section, having a first surface and a second surface opposite the first surface, and having a first electrode formed on the first surface; a first resin insulation layer formed on the first surface of the core substrate; a first conductive circuit formed on the first resin insulation layer; and a first via conductor formed in the first resin insulation layer and in an opening reaching the first electrode of the electronic component, the first via conductor connecting the first conductive circuit and the first electrode, wherein a gap between the electronic component and the inner walls of the opening section of the core substrate is filled with a resin material and resin ingredients drained from the first resin insulation layer. |
| Claim: |
4. The printed wiring board according to claim 3, wherein the coefficient of thermal expansion of the resin material is smaller than the coefficient of thermal expansion of the material that forms the core substrate. |
| Claim: |
5. The printed wiring board according to claim 4, wherein the resin material is bismaleimide resin. |
| Claim: |
6. The printed wiring board according to claim 5, wherein the bismaleimide resin contains fumed silica and polytetrafluoroethylene as filler. |
| Claim: |
7. The printed wiring board according to claim 3, further comprising a second electrode formed on the second surface of the electronic component; a second resin insulation layer formed on the second surface of the core substrate; a second conductive circuit formed on the second resin insulation layer; a through-hole conductor formed on the inner wall of the through-hole that penetrates the first and second resin insulation layers and the core substrate, and connected to the first conductive circuit and the second conductive circuit; and in the second resin insulation layer, a second via conductor which is formed in an opening reaching the second electrode of the electronic component, and which connects the second conductive circuit and the second electrode. |
| Current U.S. Class: |
174/258 |
| Current International Class: |
05; 05; 05 |
| Accession Number: |
edspap.20120279770 |
| Database: |
USPTO Patent Applications |
