Bibliographic Details
| Title: |
LED PACKAGE |
| Document Number: |
20120132949 |
| Publication Date: |
May 31, 2012 |
| Appl. No: |
13/234755 |
| Application Filed: |
September 16, 2011 |
| Abstract: |
According to one embodiment, an LED package includes mutually-separated first and second leadframes, an LED chip, and a resin body. One selected from the first leadframe and the second leadframe includes a base portion, and an extending portion. The base portion has an end surface covered with the resin body. The extending portion extends from the base portion and has an unevenness provided in a surface of the extending portion. A lower surface of the extending portion is covered with the resin body. A tip surface of the extending portion is exposed from the resin body. An exterior form of the resin body is used as an exterior form of the LED package. |
| Inventors: |
Watari, Gen (Fukuoka-ken, JP); Shimizu, Satoshi (Fukuoka-ken, JP); Komatsu, Tetsuro (Fukuoka-ken, JP) |
| Assignees: |
KABUSHIKI KAISHA TOSHIBA (Tokyo, JP) |
| Claim: |
1. An LED package, comprising: mutually-separated first and second leadframes disposed on a plane; an LED chip provided above the first and second leadframes, one terminal of the LED chip being connected to the first leadframe, one other terminal of the LED chip being connected to the second leadframe; and a resin body covering the LED chip, the resin body covering an upper surface, a portion of a lower surface and a portion of an end surface of the first leadframe, and an upper surface, a portion of a lower surface and a portion of an end surface of the second leadframe, a remaining portion of the lower surface and a remaining portion of the end surface of the first leadframe being exposed from the resin body, a remaining portion of the lower surface and a remaining portion of the end surface of the second leadframe being exposed from the resin body, one selected from the first leadframe and the second leadframe including: a base portion having an end surface covered with the resin body; and an extending portion extending from the base portion and having an unevenness provided in a surface of the extending portion, a lower surface of the extending portion being covered with the resin body, a tip surface of the extending portion being exposed from the resin body, an exterior form of the resin body being used as an exterior form of the LED package. |
| Claim: |
2. The LED package according to claim 1, wherein a protrusion is formed in a region of one selected from the lower surface of the first leadframe and the lower surface of the second leadframe, the region is separated from the other selected from the lower surface of the first leadframe and the lower surface of the second leadframe, a lower surface of the protrusion is exposed at a lower surface of the resin body, and a side surface of the protrusion is covered with the resin body. |
| Claim: |
3. The LED package according to claim 1, wherein three of the extending portions extend from the base portion in mutually different directions, and the unevenness is provided in at least one of the extending portions. |
| Claim: |
4. The LED package according to claim 1, wherein the tip surfaces of a plurality of the extending portions are exposed at three mutually different side surfaces of the resin body, and the unevenness is provided in one of the extending portions. |
| Claim: |
5. The LED package according to claim 1, wherein the base portion is not exposed at a side surface of the resin body. |
| Claim: |
6. The LED package according to claim 1, wherein the resin body is filled into a recess of the unevenness provided in the extending portion. |
| Claim: |
7. The LED, package according to claim 1, wherein the unevenness is provided in the lower surface of the extending portion. |
| Claim: |
8. The LED package according to claim 2, wherein the unevenness is provided in the lower surface of the extending portion, and a protrusion of the unevenness has a protruding length shorter than a protruding length of the protrusion of the one selected from the lower surface of the first leadframe and the lower surface of the second leadframe. |
| Claim: |
9. The LED package according to claim 8, wherein a lower surface of the protrusion of the unevenness is covered with the resin body. |
| Claim: |
10. The LED package according to claim 1, wherein a recess sunken with respect to the upper surface of the extending portion is provided. |
| Claim: |
11. The LED package according to claim 1, wherein: recesses are provided respectively in an upper surface and the lower surface of the extending portion; and a planar-direction position of the recess provided in the upper surface of the extending portion is shifted from a planar-direction position of the recess provided in the lower surface of the extending portion. |
| Claim: |
12. An LED package, comprising: mutually-separated first and second leadframes disposed on a plane; an LED chip provided above the first and second leadframes, one terminal of the LED chip being connected to the first leadframe, one other terminal of the LED chip being connected to the second leadframe; and a resin body covering the LED chip, the resin body covering an upper surface, a portion of a lower surface and a portion of an end surface of the first leadframe, and an upper surface, a portion of a lower surface and a portion of an end surface of the second leadframe, a remaining portion of the lower surface and a remaining portion of the end surface of the first leadframe being exposed from the resin body, a remaining portion of the lower surface and a remaining portion of the end surface of the second leadframe being exposed from the resin body, one selected from the first leadframe and the second leadframe including: a base portion having an end surface covered with the resin body; and an extending portion extending from the base portion, a lower surface of the extending portion being covered with the resin body, a tip surface of the extending portion being exposed from the resin body, an upper surface of the extending portion and an upper surface of the base portion being disposed on a plane, a trench being provided between the upper surface of the extending portion and the upper surface of the base portion, an exterior form of the resin body being used as an exterior form of the LED package. |
| Claim: |
13. The LED package according to claim 12, wherein a protrusion is formed in a region of one selected from the lower surface of the first leadframe and the lower surface of the second leadframe, the region is separated from the other selected from the lower surface of the first leadframe and the lower surface of the second leadframe, a lower surface of the protrusion is exposed at a lower surface of the resin body, and a side surface of the protrusion is covered with the resin body. |
| Claim: |
14. The LED package according to claim 12, wherein three of the extending portions extend from the base in mutually different directions, and the trench is provided between the upper surface of one of the extending portions and the upper surface of the base portion. |
| Claim: |
15. The LED package according to claim 12, wherein the tip surfaces of a plurality of the extending portions are exposed at three mutually different side surfaces of the resin body, and the trench is provided between the upper surface of at least one of the extending portions and the upper surface of the base portion. |
| Claim: |
16. The LED package according to claim 12, wherein the base portion is not exposed at a side surface of the resin body. |
| Claim: |
17. The LED package according to claim 12, wherein the resin body is filled into the trench. |
| Current U.S. Class: |
257/99 |
| Current International Class: |
01 |
| Accession Number: |
edspap.20120132949 |
| Database: |
USPTO Patent Applications |
