Microstructure evolution and mechanical properties of Cu-Ni-Ti transient liquid phase bonding for SiC-GH3536 joints
| Title: | Microstructure evolution and mechanical properties of Cu-Ni-Ti transient liquid phase bonding for SiC-GH3536 joints |
|---|---|
| Authors: | Zhu, Wenqi a, b, Yu, Weiyuan a, b, ⁎, Wu, Baolei a, b, Li, Yang a, b, Lin, Qiaoli a, b |
| Source: | In Materials Today Communications June 2024 39 |
| Database: | ScienceDirect |
| ISSN: | 23524928 |
|---|---|
| DOI: | 10.1016/j.mtcomm.2024.108575 |
| Published in: | Materials Today Communications |
| Language: | English |