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Mechanism analysis of strengthening interfacial thermal conductance of w-AlN/Graphene/3C-SiC typical heterostructure by graphene interlayer bonding

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Title: Mechanism analysis of strengthening interfacial thermal conductance of w-AlN/Graphene/3C-SiC typical heterostructure by graphene interlayer bonding
Authors: Song, Chuanyu a, Yang, Bing a, b, ⁎, Wei, Bowen a, Tang, Yunqing c, Wu, Xiaohu d
Source: In Ceramics International February 2025
Database: ScienceDirect
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  – Url: https://www.doi.org/10.1016/j.ceramint.2025.02.116?
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      – Type: doi
        Value: 10.1016/j.ceramint.2025.02.116
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      – Code: eng
        Text: English
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      – TitleFull: Mechanism analysis of strengthening interfacial thermal conductance of w-AlN/Graphene/3C-SiC typical heterostructure by graphene interlayer bonding
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            NameFull: Song, Chuanyu
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            NameFull: Yang, Bing
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            NameFull: Wei, Bowen
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            NameFull: Tang, Yunqing
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            – D: 01
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              Text: February 2025
              Type: published
              Y: 2025
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