Mechanism analysis of strengthening interfacial thermal conductance of w-AlN/Graphene/3C-SiC typical heterostructure by graphene interlayer bonding
| Title: | Mechanism analysis of strengthening interfacial thermal conductance of w-AlN/Graphene/3C-SiC typical heterostructure by graphene interlayer bonding |
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| Authors: | Song, Chuanyu a, Yang, Bing a, b, ⁎, Wei, Bowen a, Tang, Yunqing c, Wu, Xiaohu d |
| Source: | In Ceramics International February 2025 |
| Database: | ScienceDirect |
| ISSN: | 02728842 |
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| DOI: | 10.1016/j.ceramint.2025.02.116 |
| Published in: | Ceramics International |
| Language: | English |