Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration
Title: | Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration |
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Authors: | Hossen, M.O., Kaul, A., Nurvitadhi, E., Pant, M.D., Gutala, R., Dasu, A., Bakir, M.S. |
Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1824-1831 Nov, 2022 |
Database: | IEEE Xplore Digital Library |
ISSN: | 21563950 21563985 |
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DOI: | 10.1109/TCPMT.2022.3223687 |
Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. |