Bibliographic Details
| Title: |
Multi-level Pain Quantification using a Smartphone and Electrodermal Activity |
| Authors: |
Kong, Youngsun, Posada-Quintero, Hugo F., Chon, Ki H. |
| Source: |
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2022 44th Annual International Conference of the IEEE. :2475-2478 Jul, 2022 |
| Relation: |
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) |
| Database: |
IEEE Xplore Digital Library |
