Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mmWave application
| Title: | Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mmWave application |
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| Authors: | Ahn, Klaus, Park, Jade, Lee, Bruce, Kang, Lewis, Kim, Jay, Shin, Kyeongrok, Kim, Sung Hyuk, Lee, Jea-Duck, Kim, Myoung Kee, Lee, Ho-Seon, Park, Byeong-Gyu, Park, Bok-Ju, Kong, Tong-Ook |
| Source: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1384-1389 May, 2022 |
| Relation: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |
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