Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mmWave application

Bibliographic Details
Title: Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mmWave application
Authors: Ahn, Klaus, Park, Jade, Lee, Bruce, Kang, Lewis, Kim, Jay, Shin, Kyeongrok, Kim, Sung Hyuk, Lee, Jea-Duck, Kim, Myoung Kee, Lee, Ho-Seon, Park, Byeong-Gyu, Park, Bok-Ju, Kong, Tong-Ook
Source: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1384-1389 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Database: IEEE Xplore Digital Library