| Title: |
Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters |
| Authors: |
Rudolph, C., Hanisch, A., Voigtlander, M., Gansauer, P., Wachsmuth, H., Kuttler, S., Wittler, O., Werner, T., Panchenko, I., Wolf, M.J. |
| Source: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :40-44 Jun, 2021 |
| Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
