Surface activated bonding of Nb-Nb for surperconducting device interconnect
| Title: | Surface activated bonding of Nb-Nb for surperconducting device interconnect |
|---|---|
| Authors: | Takahashi, Yuta, Fujino, Masahisa, Matsumae, Takashi, Nakagawa, Hiroshi, Kikuchi, Katsuya, Taino, Tohru |
| Source: | 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :21-22 May, 2021 |
| Relation: | 2021 International Conference on Electronics Packaging (ICEP) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9784991191114 |
|---|---|
| DOI: | 10.23919/ICEP51988.2021.9451932 |
| Published in: | 2021 International Conference on Electronics Packaging (ICEP), Electronics Packaging (ICEP), 2021 International Conference on |