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Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

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Title: Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
Authors: Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., King, W.P.
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):220-229 Feb, 2020
Database: IEEE Xplore Digital Library
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  Data: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):220-229 Feb, 2020
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