Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
| Title: | Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles |
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| Authors: | Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., King, W.P. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):220-229 Feb, 2020 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2019.2936852 |
| Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. |