Wafer Bonding, A Key Stage For Power Devices
| Title: | Wafer Bonding, A Key Stage For Power Devices |
|---|---|
| Authors: | Cioccio, L. Di, Widiez, J., Cibie, A., De Vecchy, J., Vladimirova, K. |
| Source: | 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :20-20 May, 2019 |
| Relation: | 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9784904743072 |
|---|---|
| DOI: | 10.23919/LTB-3D.2019.8735401 |
| Published in: | 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on |