Bibliographic Details
| Title: |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems |
| Authors: |
Pan, Yu-Ming, Yang, Yu-Tao, Chou, Tzu-Chieh, Yu, Ting-Yang, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng |
| Source: |
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :111-114 Oct, 2018 |
| Relation: |
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |
