Trappen, M., Blaicher, M., Dietrich, P., Hoose, T., Xu, Y., Billah, M. R., . . . Koos, C. (2018). 3D-Printed Optics for Wafer-Scale Probing. 2018 European Conference on Optical Communication (ECOC), Optical Communication (ECOC), 2018 European Conference on, 1-3. https://doi.org/10.1109/ECOC.2018.8535123

Trappen, Mareike, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, and Christian Koos. "3D-Printed Optics for Wafer-Scale Probing." 2018 European Conference on Optical Communication (ECOC), Optical Communication (ECOC), 2018 European Conference on 2018: 1-3. https://doi.org/10.1109/ECOC.2018.8535123.

Trappen, Mareike, et al. "3D-Printed Optics for Wafer-Scale Probing." 2018 European Conference on Optical Communication (ECOC), Optical Communication (ECOC), 2018 European Conference on, 2018, pp. 1-3, https://doi.org/10.1109/ECOC.2018.8535123.