Novel ICP Plasma Etching for Backside TSV
| Title: | Novel ICP Plasma Etching for Backside TSV |
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| Authors: | Sakuishi, Toshiyuki, Murayama, Takahide, Morikawa, Yasuhiro |
| Source: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-3 Dec, 2017 |
| Relation: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781538630426 9781538630419 |
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| DOI: | 10.1109/EPTC.2017.8277505 |
| Published in: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th |