Power distribution modeling and decoupling of multilayer printed circuit board
| Title: | Power distribution modeling and decoupling of multilayer printed circuit board |
|---|---|
| Authors: | Bandyopadhyay, J. |
| Source: | IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :103-106 1999 |
| Relation: | IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 0780355970 9780780355972 |
|---|---|
| DOI: | 10.1109/EPEP.1999.819203 |
| Published in: | IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412), Electrical Performance of Electronic Packaging, 1999, Electrical performance of electronic packaging |