Correlation of wafer level wire bond and package level wire bond for bond pad quality evaluation
| Title: | Correlation of wafer level wire bond and package level wire bond for bond pad quality evaluation |
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| Authors: | Fang, Lee Kuan |
| Source: | 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) Micro and Nanoelectronics (RSM), 2017 IEEE Regional Symposium on. :244-247 Aug, 2017 |
| Relation: | 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781509040292 9781509040285 |
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| DOI: | 10.1109/RSM.2017.8069116 |
| Published in: | 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), Micro and Nanoelectronics (RSM), 2017 IEEE Regional Symposium on |