Design analysis of minichannel heat sink with indented fins under impingement flow condition
Title: | Design analysis of minichannel heat sink with indented fins under impingement flow condition |
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Authors: | Sui, Yang, Zhang, Hengyun, Li, Peichao, Lin, Tingyu |
Source: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :336-341 Aug, 2017 |
Relation: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) |
Database: | IEEE Xplore Digital Library |
ISBN: | 9781538629727 9781538629710 |
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DOI: | 10.1109/ICEPT.2017.8046467 |
Published in: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2017 18th International Conference on |