Novel WLCSP technology solution for fusion device of CMOS integrated circuit with MEMS
| Title: | Novel WLCSP technology solution for fusion device of CMOS integrated circuit with MEMS |
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| Authors: | Murayama, Takahide, Sakuishi, Toshiyuki, Morikawa, Yasuhiro |
| Source: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :554-559 Nov, 2016 |
| Relation: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781509043699 9781509043682 |
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| DOI: | 10.1109/EPTC.2016.7861541 |
| Published in: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th |