Scalable packaging platform supporting high-performance 3D chip stacks
| Title: | Scalable packaging platform supporting high-performance 3D chip stacks |
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| Authors: | Brunschwiler, Thomas, Schlottig, Gerd, Sridhar, Arvind, La Porta, Antonio, Ozsun, Ozgur, Zurcher, Jonas, Strassle, Rahel, Del Carro, Luca, Bezerra, Pedro A. M. |
| Source: | 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific. :1-7 Feb, 2017 |
| Relation: | 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781944543013 9781944543020 |
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| Published in: | 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific |