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Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

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Title: Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
Authors: Guo, Wei, Karmarkar, Aditya P., Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric
Source: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1038-1044 May, 2015
Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Database: IEEE Xplore Digital Library
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  Data: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1038-1044 May, 2015
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  Data: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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        Value: 10.1109/ECTC.2015.7159723
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        PageCount: 7
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      – TitleFull: Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes
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            NameFull: Guo, Wei
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            NameFull: Van der Plas, Geert
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            – D: 01
              M: 05
              Type: published
              Y: 2015
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