Bibliographic Details
| Title: |
Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes |
| Authors: |
Guo, Wei, Karmarkar, Aditya P., Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric |
| Source: |
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1038-1044 May, 2015 |
| Relation: |
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
