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Accelerateci life assessment methods for thermoelectric modules with mechanical stress tests

Bibliographic Details
Title: Accelerateci life assessment methods for thermoelectric modules with mechanical stress tests
Authors: Chen, Y. S., Hsu, Y. H., Ho, C. H.
Source: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International. :213-216 Oct, 2014
Relation: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Database: IEEE Xplore Digital Library
More Details
ISBN:9781479977277
ISSN:21505934
21505942
DOI:10.1109/IMPACT.2014.7048452
Published in:2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International