Murayama, T., Sakuishi, T., Morikawa, Y., Tani, N., & Saitou, K. (2014). High aspect ratio TSV etching process for high-capacitor. IEEE CPMT Symposium Japan 2014, CPMT Symposium Japan (ICSJ), 2014 IEEE, 150-153. https://doi.org/10.1109/ICSJ.2014.7009632

Murayama, Takahide, Toshiyuki Sakuishi, Yasuhiro Morikawa, Noriaki Tani, and Kazuya Saitou. "High Aspect Ratio TSV Etching Process for High-capacitor." IEEE CPMT Symposium Japan 2014, CPMT Symposium Japan (ICSJ), 2014 IEEE 2014: 150-153. https://doi.org/10.1109/ICSJ.2014.7009632.

Murayama, Takahide, et al. "High Aspect Ratio TSV Etching Process for High-capacitor." IEEE CPMT Symposium Japan 2014, CPMT Symposium Japan (ICSJ), 2014 IEEE, 2014, pp. 150-153, https://doi.org/10.1109/ICSJ.2014.7009632.