High aspect ratio TSV etching process for high-capacitor
| Title: | High aspect ratio TSV etching process for high-capacitor |
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| Authors: | Murayama, Takahide, Sakuishi, Toshiyuki, Morikawa, Yasuhiro, Tani, Noriaki, Saitou, Kazuya |
| Source: | IEEE CPMT Symposium Japan 2014 CPMT Symposium Japan (ICSJ), 2014 IEEE. :150-153 Nov, 2014 |
| Relation: | 2014 IEEE CPMT Symposium Japan (ICSJ) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781479961948 9781479961931 9781479961955 |
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| ISSN: | 23735449 |
| DOI: | 10.1109/ICSJ.2014.7009632 |
| Published in: | IEEE CPMT Symposium Japan 2014, CPMT Symposium Japan (ICSJ), 2014 IEEE |