Electrical characteristics of build-up substrates using new via structures
| Title: | Electrical characteristics of build-up substrates using new via structures |
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| Authors: | Akahoshi, Tomoyuki, Mizutani, Daisuke, Tani, Motoaki, Abe, Kenichirou, Baba, Syunji, Koide, Masateru |
| Source: | 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :490-493 Apr, 2014 |
| Relation: | 2014 International Conference on Electronics Packaging (ICEP) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9784904090107 9784904090114 |
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| DOI: | 10.1109/ICEP.2014.6826727 |
| Published in: | 2014 International Conference on Electronics Packaging (ICEP), Electronics Packaging (ICEP), 2014 International Conference on |