Fabrication and analysis of 2D embedded passive devices in PCB

Bibliographic Details
Title: Fabrication and analysis of 2D embedded passive devices in PCB
Authors: Zhang, Jing, Li, Baoxia, Wan, Lixi, Daniel, Guidotti, Cao, Liqiang, Cui, Zhiyong, Du, Tianmin, Hao, Hu
Source: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :100-104 Aug, 2013
Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)
Database: IEEE Xplore Digital Library