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Influence of diffusion on solid-state bonding for micro-bumps at low temperatures

Bibliographic Details
Title: Influence of diffusion on solid-state bonding for micro-bumps at low temperatures
Authors: Wang, Ying-Hui, Suga, Tadatomo
Source: 2013 3rd IEEE CPMT Symposium Japan CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd. :1-4 Nov, 2013
Relation: 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)
Database: IEEE Xplore Digital Library
More Details
ISBN:9781479927180
9781479908752
9781479908776
ISSN:23735449
DOI:10.1109/ICSJ.2013.6756117
Published in:2013 3rd IEEE CPMT Symposium Japan, CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd