The cost study of 300mm through silicon interposer (TSI) with BEOL interconnect
| Title: | The cost study of 300mm through silicon interposer (TSI) with BEOL interconnect |
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| Authors: | Li, H. Y., Katti, Guruprasad, Ding, L., Bhattacharya, Surya, Lo, G. Q. |
| Source: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :664-668 Dec, 2013 |
| Relation: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781479928323 9781479928347 |
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| DOI: | 10.1109/EPTC.2013.6745802 |
| Published in: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th |