Ho, S. W., Ding, L., Lim, S. H., Sek, S. A., Yu, M., & Lo, G. Q. (2013). Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5D interposer and 3D-IC. 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 435-439. https://doi.org/10.1109/EPTC.2013.6745758

Ho, S. W., L. Ding, Song How Lim, Soon Ann Sek, Mingbin Yu, and G. Q. Lo. "Polymer-based Fine Pitch Cu RDL to Enable Cost-effective Re-routing for 2.5D Interposer and 3D-IC." 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th 2013: 435-439. https://doi.org/10.1109/EPTC.2013.6745758.

Ho, S. W., et al. "Polymer-based Fine Pitch Cu RDL to Enable Cost-effective Re-routing for 2.5D Interposer and 3D-IC." 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 2013, pp. 435-439, https://doi.org/10.1109/EPTC.2013.6745758.