Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5D interposer and 3D-IC
| Title: | Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5D interposer and 3D-IC |
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| Authors: | Ho, S. W., Ding, L., Lim, Song How, Sek, Soon Ann, Yu, Mingbin, Lo, G. Q. |
| Source: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :435-439 Dec, 2013 |
| Relation: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781479928323 9781479928347 |
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| DOI: | 10.1109/EPTC.2013.6745758 |
| Published in: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th |