Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology

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Title: Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology
Authors: Tseng, W.-T., Devarapalli, V., Steffes, J., Ticknor, A., Khojasteh, M., Poloju, P., Goyette, C., Steber, D., Tai, L., Molis, S., Zaitz, M., Rill, E., Kennett, M., Economikos, L., Lustig, N., Bunke, C., Truong, C., Chudzik, M., Grunow, S.
Source: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(4):493-499 Nov, 2013
Database: IEEE Xplore Digital Library
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  Data: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(4):493-499 Nov, 2013
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