Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology
Title: | Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology |
---|---|
Authors: | Tseng, W.-T., Devarapalli, V., Steffes, J., Ticknor, A., Khojasteh, M., Poloju, P., Goyette, C., Steber, D., Tai, L., Molis, S., Zaitz, M., Rill, E., Kennett, M., Economikos, L., Lustig, N., Bunke, C., Truong, C., Chudzik, M., Grunow, S. |
Source: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(4):493-499 Nov, 2013 |
Database: | IEEE Xplore Digital Library |
FullText | Links: – Type: other Text: Availability: 0 CustomLinks: – Url: https://login.libproxy.scu.edu/login?url=https://ieeexplore.ieee.org/document/6558857 Name: EDS - IEEE (s8985755) Category: fullText Text: Check IEEE Xplore for full text MouseOverText: Check IEEE Xplore for full text. A new window will open. – Url: https://resolver.ebsco.com/c/xy5jbn/result?sid=EBSCO:edseee&genre=article&issn=08946507&ISBN=&volume=26&issue=4&date=20131101&spage=493&pages=493-499&title=IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact.&atitle=Post%20Copper%20CMP%20Hybrid%20Clean%20Process%20for%20Advanced%20BEOL%20Technology&aulast=Tseng%2C%20W.-T.&id=DOI:10.1109/TSM.2013.2273124 Name: Full Text Finder (for New FTF UI) (s8985755) Category: fullText Text: Find It @ SCU Libraries MouseOverText: Find It @ SCU Libraries |
---|---|
Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.6558857 RelevancyScore: 952 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 952.022094726563 |
IllustrationInfo | |
Items | – Name: Title Label: Title Group: Ti Data: Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Tseng%2C+W%2E-T%2E%22">Tseng, W.-T.</searchLink><br /><searchLink fieldCode="AR" term="%22Devarapalli%2C+V%2E%22">Devarapalli, V.</searchLink><br /><searchLink fieldCode="AR" term="%22Steffes%2C+J%2E%22">Steffes, J.</searchLink><br /><searchLink fieldCode="AR" term="%22Ticknor%2C+A%2E%22">Ticknor, A.</searchLink><br /><searchLink fieldCode="AR" term="%22Khojasteh%2C+M%2E%22">Khojasteh, M.</searchLink><br /><searchLink fieldCode="AR" term="%22Poloju%2C+P%2E%22">Poloju, P.</searchLink><br /><searchLink fieldCode="AR" term="%22Goyette%2C+C%2E%22">Goyette, C.</searchLink><br /><searchLink fieldCode="AR" term="%22Steber%2C+D%2E%22">Steber, D.</searchLink><br /><searchLink fieldCode="AR" term="%22Tai%2C+L%2E%22">Tai, L.</searchLink><br /><searchLink fieldCode="AR" term="%22Molis%2C+S%2E%22">Molis, S.</searchLink><br /><searchLink fieldCode="AR" term="%22Zaitz%2C+M%2E%22">Zaitz, M.</searchLink><br /><searchLink fieldCode="AR" term="%22Rill%2C+E%2E%22">Rill, E.</searchLink><br /><searchLink fieldCode="AR" term="%22Kennett%2C+M%2E%22">Kennett, M.</searchLink><br /><searchLink fieldCode="AR" term="%22Economikos%2C+L%2E%22">Economikos, L.</searchLink><br /><searchLink fieldCode="AR" term="%22Lustig%2C+N%2E%22">Lustig, N.</searchLink><br /><searchLink fieldCode="AR" term="%22Bunke%2C+C%2E%22">Bunke, C.</searchLink><br /><searchLink fieldCode="AR" term="%22Truong%2C+C%2E%22">Truong, C.</searchLink><br /><searchLink fieldCode="AR" term="%22Chudzik%2C+M%2E%22">Chudzik, M.</searchLink><br /><searchLink fieldCode="AR" term="%22Grunow%2C+S%2E%22">Grunow, S.</searchLink> – Name: TitleSource Label: Source Group: Src Data: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(4):493-499 Nov, 2013 |
PLink | https://login.libproxy.scu.edu/login?url=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edseee&AN=edseee.6558857 |
RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TSM.2013.2273124 PhysicalDescription: Pagination: PageCount: 7 StartPage: 493 Titles: – TitleFull: Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Tseng, W.-T. – PersonEntity: Name: NameFull: Devarapalli, V. – PersonEntity: Name: NameFull: Steffes, J. – PersonEntity: Name: NameFull: Ticknor, A. – PersonEntity: Name: NameFull: Khojasteh, M. – PersonEntity: Name: NameFull: Poloju, P. – PersonEntity: Name: NameFull: Goyette, C. – PersonEntity: Name: NameFull: Steber, D. – PersonEntity: Name: NameFull: Tai, L. – PersonEntity: Name: NameFull: Molis, S. – PersonEntity: Name: NameFull: Zaitz, M. – PersonEntity: Name: NameFull: Rill, E. – PersonEntity: Name: NameFull: Kennett, M. – PersonEntity: Name: NameFull: Economikos, L. – PersonEntity: Name: NameFull: Lustig, N. – PersonEntity: Name: NameFull: Bunke, C. – PersonEntity: Name: NameFull: Truong, C. – PersonEntity: Name: NameFull: Chudzik, M. – PersonEntity: Name: NameFull: Grunow, S. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 11 Type: published Y: 2013 Identifiers: – Type: issn-print Value: 08946507 – Type: issn-print Value: 15582345 – Type: issn-locals Value: edseee.IEEEJournals Numbering: – Type: volume Value: 26 – Type: issue Value: 4 Titles: – TitleFull: IEEE Transactions on Semiconductor Manufacturing, Semiconductor Manufacturing, IEEE Transactions on, IEEE Trans. Semicond. Manufact. Type: main |
ResultId | 1 |