Bibliographic Details
| Title: |
Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology |
| Authors: |
Tseng, W.-T., Devarapalli, V., Steffes, J., Ticknor, A., Khojasteh, M., Poloju, P., Goyette, C., Steber, D., Tai, L., Molis, S., Zaitz, M., Rill, E., Kennett, M., Economikos, L., Lustig, N., Bunke, C., Truong, C., Chudzik, M., Grunow, S. |
| Source: |
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(4):493-499 Nov, 2013 |
| Database: |
IEEE Xplore Digital Library |
