Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects

Bibliographic Details
Title: Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects
Authors: Hsu, Y.-Y., Lucas, K., Davis, D., Elolampi, B., Ghaffari, R., Rafferty, C., Dowling, K.
Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 60(7):2338-2345 Jul, 2013
Database: IEEE Xplore Digital Library