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Use of Harsh Wafer Probing to Evaluate Traditional and CUP Bond Pad Structures

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Title: Use of Harsh Wafer Probing to Evaluate Traditional and CUP Bond Pad Structures
Authors: Hunter, S., Martinez, J., Salas, C., Salas, M., Schofield, J., Sheffield, S., Wilkins, K., Rasmussen, B., Ruud, T., McBride, V.
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(5):880-887 May, 2013
Database: IEEE Xplore Digital Library
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  Data: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(5):880-887 May, 2013
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