Use of Harsh Wafer Probing to Evaluate Traditional and CUP Bond Pad Structures

Bibliographic Details
Title:	Use of Harsh Wafer Probing to Evaluate Traditional and CUP Bond Pad Structures
Authors:	Hunter, S., Martinez, J., Salas, C., Salas, M., Schofield, J., Sheffield, S., Wilkins, K., Rasmussen, B., Ruud, T., McBride, V.
Source:	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(5):880-887 May, 2013
Database:	IEEE Xplore Digital Library

More Details
ISSN:	21563950 21563985
DOI:	10.1109/TCPMT.2012.2236384
Published in:	IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol.