A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications
| Title: | A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications |
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| Authors: | Zhang, Xiaowu, Rajoo, Ranjan, Che, F. X., Selvanayagam, C. S., Choi, W. K., Gao, Shan, Lo, G. Q., Kwong, D.-L. |
| Source: | 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-5 Jan, 2012 |
| Relation: | 2011 IEEE International 3D Systems Integration Conference (3DIC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781467321891 9781467321884 9781467321907 |
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| DOI: | 10.1109/3DIC.2012.6263009 |
| Published in: | 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 3D Systems Integration Conference (3DIC), 2011 IEEE International |