Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., . . . Lecarpentier, G. (2012). Chip to wafer direct bonding technologies for high density 3D integration. 2012 IEEE 62nd Electronic Components and Technology Conference, Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 1960-1964. https://doi.org/10.1109/ECTC.2012.6249108

Sanchez, L., et al. "Chip to Wafer Direct Bonding Technologies for High Density 3D Integration." 2012 IEEE 62nd Electronic Components and Technology Conference, Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd 2012: 1960-1964. https://doi.org/10.1109/ECTC.2012.6249108.

Sanchez, L., et al. "Chip to Wafer Direct Bonding Technologies for High Density 3D Integration." 2012 IEEE 62nd Electronic Components and Technology Conference, Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 2012, pp. 1960-1964, https://doi.org/10.1109/ECTC.2012.6249108.